BGA Reballing Station, Diagonal Stencil Solder Template, Aluminum Alloy Rework Kit for Computer CPU Phone Manual Soldering

Specification:Item Type: BGA Reballing StationMaterial: Aluminum AlloyApplicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5inApplicable Chip: Minimum 9 x 9mm / 0.35 x 0.35in, maximum 43 x 43mm / 1.7 x 1.7inApplication: Laptop computer CPU, mobile phone, digital product, tin planting repair, BGA manual welding.Package List：1 x Reballing Platform1 x Reballing Frame1 x Hex Wrench

• PREMIUM ALUMINIUM ALLOY FRAME: The reballing station is constructed with a high-quality aluminium alloy framework, ensuring a lightweight yet durability design. This material provides excellent oxidation, extending the lifespan of the station.
• VERSATILE CHIPS SUPPORT: This reballing station is designed to handle a wide range of chips, offering compatibility with chips that range in size from 43x43mm to a maximum of 9x9mm. Its versatility makes it suitable for different digital product repairs, including mobile phones, laptops, and other devices with BGA chips.
• EASY KNOB ADJUSTMENT FOR PRECISE ALIGNMENT: The reballing station features a user-friendly knob adjustment system, allowing you to easily fine-tune and securely clamp chips in place. This feature ensures precise alignment, preventing any slippage during the soldering process.
• INNOVATIVE DIVERSION SLOT DESIGN: Equipped with a built-in diversion slot, this reballing station makes the soldering process even more efficient. The diversion slot is designed to channel excess tin beads out of the platform, keeping the working area clean and preventing any unnecessary mess.
• IDEAL FOR BGA REPAIR AND SOLDERING: The reballing station is perfectly suited for use with 90 x 90mm steel mesh, making it an excellent choice for digital product repairs, particularly CPU and BGA reballing tasks. Whether you're working on mobile phones, laptops, or other electronic devices, this station provides all the tools you need to perform effective and efficient reballing.